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SA57 SA57
DESCRIPTION
The SA57 is a fully integrated switching amplifier designed primarily to drive DC brush motors. Two independent half bridges provide over 15 amperes peak output current under microcontroller or DSC control. Thermal and short circuit monitoring is provided, which generates fault signals for the microcontroller to take appropriate action. A block diagram is provided in Figure 1. Additionally, cycle-by-cycle current limit offers user programmable hardware protection independent of the microcontroller. Output current is measured using an innovative low loss technique. The SA57 is built using a multi-technology process allowing CMOS logic control and complementary DMOS output power devices on the same IC. Use of P-channel high side FETs enables 60V operation without bootstrap or charge pump circuitry. The Power Quad surface mount package balances excellent thermal performance with the advantages of a low profile surface mount package.
Switching Amplifier
FEATURES
Low cost intelligent switching amplifier Directly connects to most embedded Microcontrollers and Digital Signal Controllers Integrated gate driver logic with dead-time generation and shoot-through prevention Wide power supply range (8.5V to 60V) Over 15A peak output current per phase 5A continuous output current per phase 8A continuous for A-Grade (SA57A) Independent current sensing for each output User programmable cycle-by-cycle current limit protection Over-current and over-temperature warning signals
APPLICATIONS

Bidirectional DC brush motors 2 unidirectional DC brush motors 2 independent solenoid actuators Stepper motors
FIgURE.BLOCKDIAgRAm
VS + VDD Vs 1 Vs 2
SC TEMP ILIM/D IS 1 I1 I2
Fault Logic
I1' I2'
VDD
VDD
D IS 2 1t 1b PWM Signals 2t 2b SGND
Gate Control
P ha se 1
I1'
I2'
O ut 1 O ut 2
Control Logic
P ha se 2
SA57 Switching Amplifier
PGND 1 GND PGND 2
SA57U
http://www.cirrus.com
Copyright (c) Cirrus Logic, Inc. 2008
(All Rights Reserved)
OCT2008 APEX - SA57UREVA
SA57
Product Innovation From
.ChARACTERISTICSANDSPECIFICATIONS
NOTES: 1. (All Min/Max characteristics and specifications are guaranteed over the Specified Operating Conditions. Typical performance characteristics and specifications are derived from measurements taken at typical supply voltages and TC = 25C). Parameter
SUPPLY VOLTAGE SUPPLY VOLTAGE LOGIC INPUT VOLTAGE OUTPUT CURRENT, peak, 10ms TEMPERATURE, junction3 TEMPERATURE RANGE, storage OPERATING TEMPERATURE, case
2
ABSOLUTEmAxImUmRATINgS
Symbol
VS VDD (-0.5) IOUT PD TJ TSTG TA -55 -40
min
max
60 5.5 (VDD+0.5) 17 100 150 125 125
Units
V V V A W C C C
POWER DISSIPATION, avg, 25C2
2. Long term operation at elevated temperature will result in reduced product life. De-rate internal power dissipation to achieve high MTBF. 3. Output current rating may be limited by duty cycle, ambient temperature, and heat sinking. Under any set of conditions, do not exceed the specified current rating or a junction temperature of 150C.
SPECIFICATIONS
Parameter
LOgIC INPUT LOW INPUT HIGH OUTPUT LOW OUTPUT HIGH OUTPUT CURRENT (SC, Temp, ILIM/DIS1) POWERSUPPLY VS VS UNDERVOLTAGE LOCKOUT, (UVLO) VDD SUPPLY CURRENT, VS SUPPLY CURRENT, VDD 20 kHz (One phase switching at 50% duty cycle) , VS=50V, VDD=5V 20 kHz (One phase switching at 50% duty cycle) , VS=50V, VDD=5V 4.5 25 UVLO 50 9 5.5 30 * * 60 * 55 * * * V V V mA 3.7 50 1.8 0.3 * * 1 * * * V V V V mA
TestConditions2
SA57 min Typ max min
SA57A Typ max
Units
5
6
*
*
mA
*
The specification of SA57A is identical to the specification for SA57 in applicable column to the left.
2

SA57U
Product Innovation From
SA57
SPECIFICATIONS,continued
Parameter
CURRENTLImIT CURRENT LIMIT THRESHOLD (Vth) Vth HYSTERESIS OUTPUT CURRENT, CONTINUOUS RISING DELAY, TD (RISE) FALLING DELAY, TD (FALL) DISABLE DELAY, TD (DIS) ENABLE DELAY, TD (DIS) RISE TIME, T (RISE) FALL TIME, T (FALL) ON RESISTANCE SOURCING (P-CHANNEL) ON RESISTANCE SINKING (N-CHANNEL) ThERmAL THERMAL WARNING THERMAL WARNING HYSTERESIS RESISTANCE, junction to case TEMPERATURE RANGE, case Full temperature range Meets Specifications -25 135 40 1.25 1.5 85 -40 * * * * 125 C C C/W C 25C Case Temperature See Figure 10 See Figure 10 See Figure 10 See Figure 10 See Figure 11 See Figure 11 5A Load 5A Load 5 270 270 200 200 50 50 300 250 750 750 8 * * * * * * 300 250 600 600 A ns ns ns ns ns ns m m 3.95 100 * * V mV
TestConditions2
SA57 min Typ max min
SA57A Typ max
Units
FIgURE2.64-PINQFP,PACKAgESTYLEhQ
SA57U

SA57
VS SUPPLY CURRENT
VS SUPPLY CURRENT (mA)
Product Innovation From
25 VS SUPPLY CURRENT (mA) 20 15 10 5 0 10
180 160 120 100 80 60 40 20 0 0 140
VS SUPPLY CURRENT
10 LOAD CURRENT (A)
CURRENT SENSE
125C 25C
1
ONE PHASE SWITCHING FREQUENCY = 20kHz 50% DUTY CYCLE
20 30 40 50 VS SUPPLY VOLTAGE (V) 60
ONE PHASE SWITCHING @ 50% DUTY CYCLE; VS=50V 50 100 150 200 250 300 FREQUENCY (kHz)
0.1 0.01
0.1 1 SENSE CURRENT (mA)
10
8 VDD SUPPLY CURRENT (mA) 7.5 7 6.5 6 5.5 5 4.5 4 10
VDD SUPPLY CURRENT
VDD SUPPLY CURRENT (mA) ONE PHASE SWITCHING FREQUENCY = 20kHz 50% DUTY CYCLE
5 4.9 4.8 4.7 4.6 4.5 0
VDD SUPPLY CURRENT
POWER DISSIPATION, PD
120 100 80 60 40 20 0 -40
POWER DERATING
SA57A
125C 25C
SA57
ONE PHASE SWITCHING @ 50% DUTY CYCLE; VS=50V 50 100 150 200 250 300 FREQUENCY (kHz)
0.8 0.75 (N-Channel) 0.7 0.65 0.6 0.55 VS=11 0.5 VS=13 0.45 VS=15 0.4 0.35 VS=17 0.3 0.25 0.2 VS>22 0.15 0 1 2 3 4 5 6 7 8 9 10 IOUT,(A)
ON RESISTANCE - BOTTOM FET
20 30 40 50 VS SUPPLY VOLTAGE (V)
60
0.8 0.75 (P-Channel) 0.7 0.65 0.6 VS=11 0.55 VS=13 0.5 0.45 VS=15 0.4 0.35 0.3 VS>17 0.25 0.2 0.15 0 1 2 3 4 5 6 7 8 9 10 IOUT,(A)
ON RESISTANCE - TOP FET
0 40 80 120 CASE TEMPERATURE, TC
RDS(on),()
RDS(on),()
DIODE FORWARD VOLTAGE - BOTTOM FET
5 4
(N-Channel)
5 4 CURRENT (A) 3 2 1
DIODE FORWARD VOLTAGE - TOP FET
(P-Channel)
CURRENT (A)
3 2 1 0 0.5
0.7 0.9 1.1 1.3 FORWARD VOLTAGE (V)
1.5
0
0.5
0.7 0.9 1.1 1.3 FORWARD VOLTAGE (V)
1.5
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SA57
FIgURE.ExTERNALCONNECTIONS
PGND 1 PGND 1 PGND 1 PGND 1 OUT 2 OUT 2 OUT 1 35 OUT 1 34 OUT 1 33 32 31 30 29 28 27 VS 2 VS 2 VS 2 VS 2 NC NC NC NC NC NC NC 36
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
OUT 2 NC PGND 2 PGND 2 PGND 2 HS
53 54 55 56 57 58
37
NC VS 1 VS 1 VS 1 NC HS
HS NC 2b NC 2t NC
59 60 61 62 63 10 12 13 14 15 16 17 18 19 11 64 1 2 3 4 5 6 7 8 9
26 25 24 23 22 20 21
HS TEMP NC DIS2 NC I1
I2
ILIM/DIS1
SC
SGND
SGND
SGND
SGND
1t
VDD
NC
NC
NC
NC
NC
NC
NC
1b
NC
NC
TABLE.PINDESCRIPTIONS
29,30,31 51,52,53 55,56,57 3 61 63 1 7
Pin#
VS (phase 1) OUT 2 PGND (phase 2) SC 2b 2t I2 ILIM/DIS1
PinName
High Voltage Supply (8.5-60V) supplies phase 1 only Half Bridge 2 Power Output High Current GND Return Path for Power Output 2 Indication of a short of an output to supply, GND or another phase Logic high commands 2 phase lower FET to turn on Logic high commands 2 phase upper FET to turn on Phase 2 current sense output As an output, logic high indicates cycle-by-cycle current limit, and logic low indicates normal operation. As an input, logic high places Logic Input/Output all outputs in a high impedance state and logic low disables the cycle-by-cycle current limit function.
Power Power Output Power Logic Output Logic Input Logic Input Analog Output
SignalType
Simplified Pin Description
SA57U

NC
5
SA57
TABLE.PINDESCRIPTIONS
5,9,11,13 15 17 19 21 23 25 46,47,48,49 33,34,35 37,38,39,40 26,27,58,59 2,4,6,8,10, 12,14,16,18, 20,22,24,28, 32,36,41,42, 43,44,45,50, 54,60,62,64
Product Innovation From
Pin#
SGND 1b 1t VDD I1 DIS2 TEMP VS (phase 2) OUT 1 PGND (phase 1) HS
PinName
Power Logic Input Logic Input Power Analog Output Logic Input Logic Output Power Power Output Power Mechanical
SignalType
Analog and digital GND - internally connected to PGND Logic high commands 1 phase lower FET to turn on Logic high commands 1 phase upper FET to turn on Logic Supply (5V) Phase 1 current sense output Logic high places all outputs in a high impedance state Thermal indication of die temperature above 135C High Voltage Supply phase 2 Half Bridge 1 Power Output High Current GND Return Path for Power Outputs 1&2 Pins connected to the package heat slug
Simplified Pin Description
NC
---
Do Not Connect
.2PinDescriptions
VS:Supply voltage for the output transistors. These pins require decoupling (1F capacitor with good high frequency characteristics is recommended) to the PGND pins. The decoupling capacitor should be located as close to the VS and PGND pins as possible. Additional capacitance will be required at the VS pins to handle load current peaks and potential motor regeneration. Refer to the applications section of this datasheet for additional discussion regarding bypass capacitor selection. Note that Vs pins 29-31 carry only the phase 1 supply current. Pins 46-49 carry supply current for phase2. Phase 1 may be operated at a different supply voltage from phase 2. Only the B & C supply pins (46-49) are monitored for undervoltage conditions. OUT,OUT2:These pins are the power output connections to the load. NOTE: When driving an inductive load, it is recommended that two Schottky diodes with good switching characteristics (fast tRR specs) be connected to each pin so that they are in parallel with the parasitic back-body diodes of the output FETs. (See Section 2.6) PgND:Power Ground. This is the ground return connection for the output FETs. Return current from the load flows through these pins. PGND is internally connected to SGND through a resistance of a few ohms. See section 2.1 of this datasheet for more details. SC:Short Circuit output. If a condition is detected on any output which is not in accordance with the input commands, this indicates a short circuit condition and the SC pin goes high. The SC signal is blanked for approximately 200ns during switching transitions but in high current applications, short glitches may appear on the SC pin. A high state on the SC output will not automatically disable the device. The SC pin includes an internal 12k series resistor. b,2b:These Schmitt triggered logic level inputs are responsible for turning the associated bottom, or lower Nchannel output FETs on and off. Logic high turns the bottom N-channel FET on, and a logic low turns the low side N-channel FET off. If 1b or 2b is high at the same time that a corresponding 1t or 2t input is high, protection circuitry will turn off both FETs in order to prevent shoot-through current on that output phase. Protection circuitry also in-
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SA57
cludes a dead-time generator, which inserts dead time in the outputs in the case of simultaneous switching of the top and bottom input signals. t,2t:These Schmitt triggered logic level inputs are responsible for turning the associated top side, or upper Pchannel FET outputs on and off. Logic high turns the top P-channel FET on, and a logic low turns the top P-channel FET off. I,I2:Current sense pins. The SA57 supplies a positive current to these pins which is proportional to the current flowing through the top side P-channel FET for that phase. Commutating currents flowing through the back-body diode of the P-channel FET or through external Schottky diodes are not registered on the current sense pins. Nor do currents flowing through the low side N-channel FET, in either direction, register at the current sense pins. A resistor connected from a current sense pin to SGND creates a voltage signal representation of the phase current that can be monitored with ADC inputs of a processor or external circuitry. The current sense pins are also internally compared with the current limit threshold voltage reference, Vth. If the voltage on any current sense pin exceeds Vth, the cycle by cycle current limit circuit engages. Details of this functionality are described in the applications section of this datasheet. ILIm/DIS: This pin is directly connected to the disable circuitry of the SA57. Pulling this pin to logic high places OUT 1 and OUT 2 in a high impedance state. This pin is also connected internally to the output of the current limit latch through a 12k resistor and can be monitored to observe the function of the cycle-by-cycle current limit feature. Pulling this pin to a logic low effectively disables the cycle-by-cycle current limit feature. SgND:This is the ground return connection for the VDD logic power supply pin. All internal analog and logic circuitry is referenced to this pin. PGND is internally connected to GND through a resistance of a few ohms,. However, it is highly recommended to connect the GND pin to the PGND pins externally as close to the device as possible. Failure do to this may result in oscillations on the output pins during rising or falling edges. VDD:This is the connection for the 5V power supply, and provides power for the logic and analog circuitry in the SA57. This pin requires decoupling (at least 0.1F capacitor with good high frequency characteristics is recommended) to the SGND pin. DIS2: The DIS2 pin is a Schmitt triggered logic level input that places OUT 1 and OUT 2 in a high impedance state when pulled high. DIS2 has an internal 12k pull-down resistor and may therefore be left unconnected. TEmP:This logic level output goes high when the die temperature of the SA57 reaches approximately 135C. This pin WILL NOT automatically disable the device. The TEMP pin includes a 12k series resistor. hS:These pins are internally connected to the thermal slug on the reverse of the package. They should be connected to GND. Neither the heat slug nor these pins should be used to carry high current. NC:These "no-connect" pins should be left unconnected.
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2.SA57OPERATION
Product Innovation From
The SA57 is designed primarily to drive DC brush motors. However, it can be used for any application requiring two high current outputs. The signal set of the SA57 is designed specifically to interface with a DSP or microcontroller. A typical system block diagram is shown in the figure below. Over-temperature, Short-Circuit and Current Limit fault signals provide important feedback to the system controller which can safely disable the output drivers in the presence of a fault condition. High side current monitors for both phases provide performance information which can be used to regulate or limit torque.
FIgURE4.SYSTEmDIAgRAm
VDD SC TEMP ILIM/D IS 1
Vs + Vs 1 Vs 2
Fault Logic
Current I1 monitor Signals I2
GND
D IS 2 1t 1b PWM Signals 2t 2b SGND
DC BRUSH MOTOR
Control Logic
Gate Control
1 2
OUT 1 OUT 2
M icrocontroller or DSC
SA57 Switching Amplifier PGND 1 SGND GND PGND 2
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SA57
The block diagram in Figure 5 illustrates the features of the input and output structures of the SA57. For simplicity, a single phase is shown.
FIgURE5.INPUTANDOUTPUTSTRUCTURESFORASINgLEPhASE
12k SC Logic Vdd I1' 12k + _ _ Temp Sense Ref Vth Current Sense
SC
I LIM/DIS1 I1
12k
Lim 1 Lim 2
UVLO
DIS2 12k 1t Gate Control 1b SGND PGND OUT 1 Vs
TABLE2.TRUThTABLE
ILIM/DIS1 OUT 1 OUT 2 1b, 2b 1t, 2t I1, I2 DIS2 Comments
0 0 1 1
0X 1 X X >Vth XX XX XX XX X X X X
Top and Bottom output FETs for that phase are turned off. Bottom output FET for that phase is turned on. Top output FET for that phase is turned on. Both output FETs for that phase are turned off. Voltage on I1 or I2 has exceeded Vth, which causes ILIM/DIS1 to go high. 1 X High-Z This internally disables Top and Bottom output FETs for ALL phases. X 1 High-Z DIS2 pin pulled high, which disables all outputs. Pulled Pulling the ILIM/DIS1 pin high externally acts as a second disable input, X High-Z High which disables ALL output FETs. Determined Pulling the DIS2 pin low externally disables the cycle-by-cycle current limit Pulled 0 by PWM function. The state of the outputs is strictly a function of the PWM inputs. Low inputs X X High-Z If VS is below the UVLO threshold all output FETs will be disabled.
X 0 0 X
X 0 0 X
High-Z PGND VS High-Z
SA57U

+
TEMP
SA57
2.LAYOUTCONSIDERATIONS
Product Innovation From
Output traces carry signals with very high dV/dt and dI/dt. Proper routing and adequate power supply bypassing ensures normal operation. Poor routing and bypassing can cause erratic and low efficiency operation as well as ringing at the outputs. The VS supply should be bypassed with a surface mount ceramic capacitor mounted as close as possible to the VS pins. Total inductance of the routing from the capacitor to the VS and GND pins must be kept to a minimum to prevent noise from contaminating the logic control signals. A low ESR capacitor of at least 25F per ampere of output current should be placed near the SA57 as well. Capacitor types rated for switching applications are the only types that should be considered. The bypassing requirements of the VDD supply are less stringent, but still necessary. A 0.1F to 0.47F surface mount ceramic capacitor (X7R or NPO) connected directly to the VDD pin is sufficient. SGND and PGND pins are connected internally. However, these pins must be connected externally in such a way that there is no motor current flowing in the logic and signal ground traces as parasitic resistances in the small signal routing can develop sufficient voltage drops to erroneously trigger input transitions. Alternatively, a ground plane may be separated into power and logic sections connected by a pair of back to back Schottky diodes. This isolates noise between signal and power ground traces and prevents high currents from passing between the plane sections. Unused area on the top and bottom PCB planes should be filled with solid or hatched copper to minimize inductive coupling between signals. The copper fill may be left unconnected, although a ground plane is recommended.
2.2FAULTINDICATIONS
In the case of either an over-temperature or short circuit fault, the SA57 will take no action to disable the outputs. Instead, the SC and TEMP signals are provided to an external controller, where a determination can be made regarding the appropriate course of action. In most cases, the SC pin would be connected to a FAULT input on the processor, which would immediately disable its PWM outputs. The TEMP fault does not require such an immediate response, and would typically be connected to a GPIO, or Keyboard Interrupt pin of the processor. In this case, the processor would recognize the condition as an external interrupt, which could be processed in software via an Interrupt Service Routine. The processor could optionally bring all inputs low, or assert a high level to either of the disable inputs on the SA57. Figure 6 shows an external SR flip-flop which provides a hard wired shutdown of all outputs in response to a fault indication. An SC or TEMP fault sets the latch, pulling the disable pin high. The processor clears the latched condition with a GPIO. This circuit can be used in safety critical applications to remove software from the fault-shutdown loop, or simply to reduce processor overhead.
FIgURE6.ExTERNALFAULTLATChCIRCUIT
PWM
SA57
PROCESSOR DIS2
SC TEMP
GPIO In applications which may not have available GPIO, the TEMP pin may be externally connected to the LATCHED FAULT INTERRUPT adjacent DIS1 pin. If the device temperature reaches ~135C all outputs will be disabled, de-energizing the motor. The SA57 will re-energize the motor when the device temperature falls below approximately 95C. The TEMP pin hysteresis is wide to reduce the likelihood of thermal oscillations which can greatly reduce the life of the device.
FAULT RESET
2.3 UNDER-VOLTAGE LOCKOUT
The undervoltage lockout condition results in the SA57 unilaterally disabling all output FETs until VS is above the UVLO threshold indicated in the spec table. There is no external signal indicating that an undervoltage lockout condition is in progress. The SA57 has two VS connections: one for phase 1 and another for phase 2. The supply volt-
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SA57U
Product Innovation From
SA57
FiGURE 7. START-UP VOLTAGE AND CURRENT
NON-LIMITED MOTOR CURRENT NON-LIMITED BACK EMF
ages on these pins need not be the same, but the UVLO will engage if either is below the threshold. Hysteresis on the UVLO circuit prevents oscillations with typical power supply variations.
2.4CURRENTSENSE
External power shunt resistors are not required with the SA57. Forward current in each top, PLIMITED BACK EMF channel output FET is measured and mirrored to the respective current sense output pin, I1 and I2. By connecting a resistor between each current sense pin and a reference, such as ground, LIMITED MOTOR CURRENT a voltage develops across the resistor that is proportional to the output current for that phase. An ADC can monitor the voltages on these resistors for protection or for closed loop torque control in some application configurations. The current sense pins source current from the VDD supply. Headroom required for the current sense circuit is TIME approximately 0.5V. The nominal scale factor for each proportional output current is shown in the typical performance plot on page 4 of this datasheet.
2.5CYCLE-BY-CYCLECURRENTLImIT
In applications where the current in the motor is not directly controlled, both the average current rating of the motor and the inrush current must be considered when selecting a proper amplifier. For example, a 1A continuous motor might require a drive amplifier that can deliver well over 10A peak in order to survive the inrush condition at startup. Because the output current of each upper output FET is measured, the SA57 is able to provide a very robust current limit scheme. This enables the SA57 to safely and easily drive virtually any DC brush motor through a start-up inrush condition. With limited current, the starting torque and acceleration are also limited. The plot in Figure 7 shows starting current and back EMF with and without current limit enabled. If the voltage of any of the two current sense pins exceeds the current limit threshold voltage (Vth), all outputs are disabled. After all current sense pins fall below the Vth threshold voltage AND the offending phase's top side input goes low, the output stage will return to an active state on the rising edge of ANY top side input command signal (1t or 2t). With most commutation schemes, the current limit will reset each PWM cycle. This scheme regulates the peak current in each phase during each PWM cycle as illustrated in the timing diagram below. The ratio of average to peak current depends on the inductance of the motor winding, the back EMF developed in the motor, and the width of the pulse. Figure 8 illustrates the current limit trigger and reset sequence. Current limit engages and ILIM/DIS1 goes high when any current sense pin exceeds Vth. Notice that the moment at which the current sense signal exceeds the Vth threshold is asynchronous with respect to the input PWM signal. The difference between the PWM period and the motor winding L/R time constant will often result in an audible beat frequency sometimes called a sub-cycle oscillation. This oscillation can be seen on the ILIM/DIS1 pin waveform in Figure 8. Input signals commanding 0% or 100% duty cycle may be incompatible with the current limit feature due to the absence of rising edges of 1t and 2t. At high RPM, this may result in poor performance. At low RPM, the motor may stall if the current limit trips and the motor current reaches zero without a commutation edge which will typically reset the current limit latch.
SA57U

SA57
The current limit feature may be disabled by tying the ILIM/DIS1 pin to GND. The current sense pins will continue to provide top FET output current information. Typically, the current sense pins source current into grounded resistors which provide voltages to the current limit comparators. If instead the current limit resistors are connected to a voltage output DAC, the current limit can be controlled dynamically from the system controller. This technique essentially reduces the current limit threshold voltage to (Vth-VDAC). During expected conditions of high torque demand, such as start-up or reversal, the DAC can adjust the current limit dynamically to allow periods of high current. In normal operation when low current is expected, the DAC output voltage can increase, reducing the current limit setting to provide more conservative fault protection.
Product Innovation From
FiGURE 8. CURRENT LimiT WAVEFORmS
It INPUT
Vth
I1
OUT 1
ILIM/DIS1
2.6ExTERNALFLYBACKDIODES
External fly-back diodes will offer superior reverse recovery characteristics and lower forward voltage drop than the internal back-body diodes. In high current applications, external flyback diodes can reduce power dissipation and heating during commutation of the motor current. Reverse recovery time and capacitance are the most important parameters to consider when selecting these diodes. Ultra-fast rectifiers offer better reverse recovery time and Schottky diodes typically have low capacitance. Individual application requirements will be the guide when determining the need for these diodes and for selecting the component which is most suitable.
FIgURE.SChOTTKYDIODES
VS OUT 1 VS
SA57 OUT 2
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Product Innovation From
SA57
FIgURE0.TImINgDIAgRAmS
TOP INPUT
BOTTOM INPUT
DISABLE
OUTPUT
DELAY TIMING
td(fall)
td(rise)
td(dis)
td(dis)
td(dis)
td(dis)
.POWERDISSIPATION
The thermally enhanced package of the SA57 allows several options for managing the power dissipated in the two output stages. Power dissipation in traditional PWM applications is a combination of output power dissipation and switching losses. Output power dissipation depends on the quadrant of operation and whether external flyback diodes are used to carry the reverse or commutating currents. Switching losses are dependent on the frequency of the PWM cycle as described in the typical performance graphs.
FIgURE.OUTPUTRESPONSE
80%
OUTPUT 20%
The size and orientation of the heatsink must be selected to manage the average power dissipation t(rise) t(fall) of the SA57. Applications vary widely and various thermal techniques are available to match the reTOP INPUT quired performance. The patent pending mounting technique shown in Figure 12, with the SA57 inverted and suspended through a cutout in the PCB BOTTOM INPUT is adequate for power dissipation up to 17W with the HS33, a 1.5 inch long aluminum extrusion with four fins. In free air, mounting the PCB perpendicular to the ground, such that the heated air flows upward along the channels of the fins can provide a total JA of less than 14 C/W (9W max average PD). Mounting the PCB parallel to the ground impedes the flow of heated air and provides a JA of 16.66 C/W (7.5W max average PD). In applications in which higher power dissipation is expected or lower junction or case temperatures are required, a larger heatsink or circulated air can significantly improve the performance.
4.ORDERINgANDPRODUCTSTATUSINFORmATION
MODEL SA57-IHZ SA57A-FHZ TEMPERATURE -25 to 85C -40 to +125C PACKAGE 64 pin Power QFP (HQ package drawing) 64 pin Power QFP (HQ package drawing) PRODUCTION STATUS Samples Available Samples Available
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SA57
FIgURE2.hEATSINKTEChNIQUE
Product Innovation From
PATENTPENDINg
CONTACTINgCIRRUSLOgICSUPPORT
For all Apex Precision Power product questions and inquiries, call toll free 800-546-2739 in North America. For inquiries via email, please contact tucson.support@cirrus.com. International customers can also request support by contacting their local Cirrus Logic Sales Representative. To find the one nearest to you, go to www.cirrus.com
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SA57U

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Price & Availability of SA57

	To Download SA57 Datasheet File
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